forbid 2016-3-4 00:46
内外兼修 vivo Xplay5 拆解[34P]
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[size=16px]vivo于近日发布了全新旗舰Xplay5系列手机，Xplay5采用了双曲面屏+一体化金属机身的设计，外观相当惊艳，并采用了vivo全新的HiFi 3.0系统，考虑到以往vivo在音频方面的优异表现，我们毫无疑问对Xplay5的音质有着很高的期待，现在就请跟随我们的脚步来看看vivo超强音质的奥秘在哪里吧。[/size]
[size=16px]PS：vivo Xplay5 的结构较为复杂，很多零部件拆解后很难还原，请普通用户不要轻易尝试。
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[size=16px]在开始拆解之前记得拔出SIM插槽。[/size]
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[size=16px]Xplay5有着vivo的一贯设计风格，底部USB接口处有两个梅花螺丝，我们从这里开始拆解。[/size]
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[size=16px]因为Xplay5采用了双曲面玻璃+全金属一体机身的设计，因为我们智能从屏幕拆起。[/size]
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[size=16px]使用吸盘将屏幕吸起来，双曲面玻璃先与白色垫圈黏贴在一起，再通过卡扣与金属后盖固定，拆解中要小心处理，防止卡扣断裂。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d7ff3bdbd5d.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d7ff3bdbd5d.jpg[/img][/url][/size]
[size=16px]将屏幕和后盖分解后就可以看到内部的结构了。后盖为vivo惯用的金属一体式后盖，后盖内部并没有之前的注塑NFC天线，Xplay5极有可能是阉割了NFC功能。[/size]
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[size=16px]电路设计上则为比较准备的主板+电池+副版的设计。[/size]
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[size=16px]按压式[url=http://www.leiphone.com/tag/%E6%8C%87%E7%BA%B9%E8%AF%86%E5%88%AB]指纹识别[/url]安装在后盖上，通过触点与主板相连，相对简化了后盖的拆卸难度。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8006c3b4f9.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8006c3b4f9.jpg[/img][/url][/size]
[size=16px]电池通过双面胶黏贴在中框上，需要加热+拨片将它拆卸下来。[/size]
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[size=16px]先断开手机的电池排线。vivo的所有排线都是用来金属挡板+螺丝固定，防止排线因晃动而产生松动。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d800a4edeeb.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d800a4edeeb.jpg[/img][/url][/size]
[size=16px]电池使用锂离子聚合电池，容量为3600mAh。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d800e0d8e38.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d800e0d8e38.jpg[/img][/url][/size]
[size=16px]所有的排线包括摄像头都使用了金属挡板进行固定，我们将其逐一拆下。[/size]
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[size=16px]为了便于分离主板，我们将扬声器副板和金属挡板全部拆下，随后将包括屏幕排线在内的各种排线、同轴电缆分离后，再进行进一步拆解。[/size]
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[size=16px]扬声器、USB接口和振动马达在副板之内。[/size]
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[size=16px]接下来就可以将主板取下来了，主板上布满了金属屏蔽罩，基本上没有什么裸露的芯片。[/size]
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[size=16px]主板背面同样布满了金属屏蔽罩，并有一整块铜箔片覆盖在屏蔽罩之上，用于增强各芯片的散热。[/size]
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[size=16px]将主板拆下后我们就可以将摄像头拆卸下来了。Xplay 5的后置摄像头为1600 万像素，使用索尼IMX298传感器，镜头光圈f2.0，并没有光学防抖。前置为800万，所以两者在体积上比较接近。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d802427a4a7.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d802427a4a7.jpg[/img][/url][/size]
[size=16px]我们将主板背面的铜箔片撕开后，就可以看到下面大面积的金属屏蔽罩，其中涂抹导热的位置为SoC+闪存芯片。如此多的金属屏蔽罩应该是为了HiFi系统所设计，用以减少芯片之间的互相干扰。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d802790cdf7.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d802790cdf7.jpg[/img][/url][/size]
[size=16px]Xplay5 的屏蔽罩全部使用焊锡焊接在主板上，我们使用热风枪加热后将其逐一拆下。[/size]
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[size=16px]将大部分屏蔽罩拆下的可以看到各种芯片的具体型号了。[/size]
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[size=16px]主板背面最显眼的三星的0BMFGCF-K30F4F4的LPDDR3L内存芯片，容量为4GB，下面封装着高通骁龙652，4枚Cortex-A72和4枚Cortex-A53共同组成，使用28nm HPM工艺制造，搭配Adreno 510 图形处理器。[/size]
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[size=16px]另外一块体积比较大的是来自东芝的THGBMHG9C8LBAIG闪存芯片，使用15nm工艺，符合eMMC 5.1规范，容量为128GB。[/size]
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[size=16px]接下来终于到了音频芯片，这块来自Cirrus Logic的CS4398CN DAC芯片。CS4398CN是Cirrus Logic的顶级解码芯片， 该细腻盘支持24 bit/192kHz解码，信噪比为120dB，失真率-107dB，是一块很经典的DAC芯片，vivo对于调校该芯片相当有心得。[/size]
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[size=16px]CS4398CN旁边来自德州仪器的51AP8LI ADC3001音频转换芯片。[/size]
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[size=16px]在DAC芯片旁边，我们还发现了一颗型号为"539Y5P"的芯片，疑似为vivo宣传的AD45257运放芯片。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d80801a4c85.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d80801a4c85.jpg[/img][/url][/size]
[size=16px]来自高通的PM8004电源管理芯片。[/size]
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[size=16px]高通PM8956 PMIC芯片（电源管理集成电路）。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8069703637.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8069703637.jpg[/img][/url][/size]
[size=16px]高通PMI8952 PMIC芯片（电源管理集成电路）。[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d806fc6da2b.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d806fc6da2b.jpg[/img][/url][/size]
[size=16px]高通WTR2965射频芯片。[/size]
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[size=16px]Skyworks 77824-11 RF射频功放。（FDD LTE）[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8079e028e0.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d8079e028e0.jpg[/img][/url][/size]
[size=16px]Skyworks 77629-21射频功放。（ GSM EDGE WCDMA HSDPA）[/size]
[size=16px][url=http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d80a307d6bc.jpg][img]http://7te8bu.com1.z0.glb.clouddn.com/uploads/new/article/740_740/201603/56d80a307d6bc.jpg[/img][/url][/size]
[size=16px]最后奉上vivo Xplay5的拆解全家福。[/size]
[size=16px]从本次拆解来看，Xplay5 延续了vivo一贯的优秀工作，主板设计十分工整，几乎所有芯片都被屏蔽罩所覆盖，且在发热比较大的处理器+内存芯片部分使用了导热硅脂+铜箔的方式辅助散热，在排线处也有专门金属挡板固定，用料可谓比较良心。整机采用曲面屏+一体化金属后盖的设计，结构相当紧凑严谨。作为第一款双曲面屏+全金属一体机身的国产手机，vivo Xplay5不仅拥有靓丽的外表，还有着相当可靠的内部设计，可谓称得上内外兼修。[/size]
q87571656 2016-3-9 14:15
我就问一个问题，号称的国产第一款“双曲面屏”，敢开发出匹配曲面屏的os插件和app么？否则你比个卵的三星edge。不过也是，太复杂的使用模式，工仔厂妹们又如何爱得起来~V厂和华为，不愧为国货骄傲，售价很骄傲！
拍照找小米5是为了对比现在3部IMX298的表现，而后面跑分是为了对比652和前代旗舰，652和820有非常明显的性能差距，而且它们是同代不同段位的产品，所以没放在一起比较。
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